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High-Frequency PCB & RF Laminates
Pure Blue SV260-30-H Advanced Copper Clad Laminate Bare Board for RF & 5G Applications
Pure Blue SV260-30-H is a high-performance copper clad laminate bare board engineered to meet the demanding requirements of RF, microwave, and next-generation 4G/5G communication systems. Designed with excellent dielectric stability and low signal loss, this laminate ensures consistent electrical performance even at high frequencies.
Built for precision, reliability, and long-term performance, SV260-30-H offers superior thermal stability, strong copper adhesion, and excellent dimensional control, making it an ideal choice for high-speed, high-frequency PCB designs. Its material characteristics support clean signal transmission, reduced interference, and enhanced efficiency in critical RF environments.
Whether used in base station antennas, wireless communication modules, or advanced RF circuits, Pure Blue SV260-30-H delivers a balanced combination of performance, durability, and manufacturability, helping designers and manufacturers achieve stable, high-quality PCB solutions for modern communication technologies.
Copper Clad Laminate Sheet – Pure Blue SV260-30-H
Copper Clad Laminate Sheet – Pure Blue SV260-30-H
The Pure Blue SV260-30-H copper clad laminate sheet is a polymer-based, double-sided laminate supplied with electro-deposited copper foil on both surfaces. The laminate exhibits a stable dielectric constant (2.60 in X-Y direction and 2.45 in Z direction) and an ultra-low dissipation factor below 0.0008 at 5–10 GHz, ensuring consistent electrical behavior across the sheet.
The material features strong copper adhesion with peel strength ranging from 2.2 to 3.5 N/mm, low moisture absorption below 0.03%, and high electrical insulation properties, including volume and surface resistivity of 10⁷ MΩ·cm. The substrate maintains mechanical integrity within an operating temperature range of –45 °C to +95 °C and has a heat deflection temperature of 95 °C.
Our Product
Our Product
Pure Blue SV260-30-H Copper Clad Laminate Board
Pure Blue SV260-30-H Copper Clad Laminate Board
This image shows a precision-etched RF circuit pattern fabricated on Pure Blue SV260-30-H copper clad laminate. The laminate features a dielectric constant (Dk) of 2.6 and an ultra-low dissipation factor (Df) of 0.0008, enabling stable impedance control and minimal signal loss across high-frequency operation.
The uniform copper distribution and clean trace definition highlight the laminate’s excellent copper adhesion, dimensional stability, and fine-line processing capability. Based on a polymer substrate with electro-deposited copper foil, the board demonstrates consistent electrical behavior and surface quality, making it well suited for high-frequency circuit fabrication where low loss and repeatability are critical.
Our Advantage
Our Advantage
Products & Applications
Products & Applications
Pure Blue SV260-30-H copper clad laminate boards are used in a wide range of high-frequency and low-loss RF products, where stable electrical performance and minimal signal attenuation are critical. Typical products and systems include:
4G / 5G Antenna Arrays and Antenna Panels
RF Front-End Modules
Microwave and RF Signal Distribution Boards
High-Gain Antenna Feed Networks
Wireless Communication Equipment
Base Station and Small Cell RF Circuits
Radar and Microwave Subsystems
Test & Measurement RF Boards
High-Frequency Impedance-Controlled PCBs
Proprietary low loss radome compounds 5G and high end RF ready
We developed super low loss polyolefin based radome injection molding compounds with various UL94 ratings to meet the high-end RF antenna demands.
Proprietary low loss radome compounds 5G and high end RF ready
Proprietary low loss radome compounds 5G and high end RF ready
We developed super low loss polyolefin based radome injection molding compounds with various UL94 ratings to meet the high-end RF antenna demands.
Our UV stabilized and V-2 UL94 rated compounds may have as low dissipation factor (DF) as 0.0023 at 4G cell phone frequencies and only slightly higher DF at the carrier frequencies.
A UV stabilized compound rated to HB UL94 may go down to DF 0.001 or yet better at up to 10 GHz.
For applications where very high tensile strength is required, we may provide a compound measured to deliver 60 to 75 MPa with a somewhat compromised DF due to a heavy reinforcement loading.
Soldering Recommendations
Soldering Recommendations
We strongly recommend reviewing the relevant TDS section before soldering.
Soldering thermoplastic laminate materials (such as PTFE, PET, PE, PP, PC, PPO) is different from soldering FR-4 and other thermoset materials, mainly because heat transfer to the copper must be carefully controlled.
Manual soldering can be performed using any RoHS-compliant solder. The soldering iron should be preheated to 330–350 °C, and the temperature must be verified before use. It is critical to limit the heating time on the solder pad—only the minimum time required to achieve proper solder wetting should be applied.
Applying excessive heat may result in weak solder joints or pad delamination. However, with basic operator training, reliable and repeatable solder joints can be achieved in standard production environments.
Special care is required when soldering rigid or semi-rigid cable ground connections, as these often involve prolonged soldering and higher heat input. To avoid substrate warping, it is recommended to optimize the PCB design in the grounding area. A practical approach is to break large solid copper areas into a dotted or segmented pattern, which helps limit heat spreading across the copper surface.
For best results, we recommend consulting with the technical team when designing cable ground or braid soldering areas.
Etching & PCB Processing
Etching & PCB Processing
Pure Blue laminate products can be processed by qualified PCB manufacturing facilities with appropriate experience and equipment. We have established relationships with several processing partners and plan to share their contact information on our website in the future.
During the current phase, processing house recommendations are provided upon request, and each customer inquiry will be addressed individually in writing.
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